Teknik
Halvledarfabrik
Wafer, litografi, kemikalier och OSAT-packning bakom varje chip.
⚠ EUV-verktyg & avancerad packning
Viktiga flaskhalsar
- EUV lithographyEquipment
ASML is the sole EUV supplier; tool delivery slots gate advanced node ramps.
Relaterade tickers: ASML
- High-NA EUV optics & pelliclesComponents
Pellicle yield and optics supply constrain High-NA rollout.
- Advanced packaging (CoWoS / HBM)OSAT
CoWoS capacity at TSMC and OSAT partners is the binding constraint on AI GPU shipments.
Relaterade tickers: TSM