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Technology

Semiconductor fab

Wafers, lithography, chemicals, and OSAT packaging behind every chip.

⚠ EUV tools & advanced packaging

Key chokepoints

  • EUV lithographyEquipment

    ASML is the sole EUV supplier; tool delivery slots gate advanced node ramps.

    Related tickers: ASML

  • High-NA EUV optics & pelliclesComponents

    Pellicle yield and optics supply constrain High-NA rollout.

  • Advanced packaging (CoWoS / HBM)OSAT

    CoWoS capacity at TSMC and OSAT partners is the binding constraint on AI GPU shipments.

    Related tickers: TSM

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