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Technology

Large Language Model

From HBM memory to grid power — the hidden stack behind every chatbot.

⚠ HBM memory & CoWoS packaging

Key chokepoints

  • GPU / AI accelerator siliconSemiconductors

    Leading-edge nodes (3–5 nm) and HBM packaging are concentrated among a handful of fabs and OSAT partners.

    Related tickers: NVDA, TSM

  • High-bandwidth memory (HBM)Memory

    Only SK hynix, Samsung, and Micron supply HBM3e at volume; lead times stretch during AI build-outs.

    Related tickers: 000660.KS

  • CoWoS advanced packagingPackaging

    TSMC CoWoS capacity has been a binding constraint on AI accelerator shipments.

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